| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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2 pcs
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2 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This Intel FPGA, part number EP2AGX190FF35I3N, belongs to the Arria II GX series. It features 612 user I/O pins and is housed in a 1152-ball fine ball grid array (FBGA) package, specifically the 1152-BBGA, FCBGA variant.
Key specifications include 181,165 logic elements and 7,612 LABs, providing substantial capacity for complex digital processing. It also offers 10,177,536 total RAM bits for fast memory access. The device operates with a supply voltage between 0.87V and 0.93V and is designed for surface mounting.
The operating temperature range is -40°C to 100°C (TJ), making it suitable for demanding environments. This FPGA is designed for applications in telecom, networking, high-end industrial, military, and data processing sectors, supporting hardware accelerators and advanced signal processing.
Considerations for usage include following moisture sensitivity handling procedures (MSL 1) and verifying compatible mounting and reflow soldering profiles for the FCBGA package.
The supply voltage is 0.87V to 0.93V.
It has 612 I/O pins.
The total RAM bits are 10,177,536.
The operating temperature is -40°C to 100°C (TJ).
It is in a 1152-BBGA, FCBGA package.
There are 181,165 logic elements.