| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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40 pcs
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40 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
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2 pcs
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2 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The EP2AGX125EF29I5N is a field-programmable gate array (FPGA) produced by Intel. It contains 118143 logic elements and 8315904 RAM bits, suitable for complex digital logic applications. The device offers 372 I/O pins, enabling extensive connectivity options. It is housed in a 780-FBGA package with a 29x29 mm footprint, designed for surface mounting on printed circuit boards.
This FPGA is used in embedded systems requiring high logic density and I/O capacity. Its package features industry-standard static shielding and anti-static packaging for protection during handling and assembly. The operating voltage range is 0.87V to 0.93V, and it operates within a temperature range of -40°C to 100°C. The device is compliant with RoHS standards and has a Moisture Sensitivity Level of 1.
Designed for high-performance digital logic, the FPGA supports complex logic designs, including logic elements, embedded logic, and I/O configurations. It is suitable for applications in communications, data processing, and embedded control systems where reliability and density are critical.
The FPGA contains 118143 logic elements.
The device has 372 I/O pins.
The supply voltage range is 0.87V to 0.93V.
It is packaged in a 780-FBGA (29x29 mm).
The operating temperature range is -40°C to 100°C.