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EP20K300EFC672-3 The EP20K300EFC672-3 is an FPGA from Intel featuring 408 I/O pins and a 672FBGA package. It is used in embedded systems requiring high I/O capacity.
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EP20K300EFC672-3

Available from 1 distributors
Mfr Name: Intel
Intel
The EP20K300EFC672-3 is an FPGA from Intel featuring 408 I/O pins and a 672FBGA package. It is used in embedded systems requiring high I/O capacity.
✓ Total Stock: 2 pcs

EP20K300EFC672-3 Available from 1 distributor

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Components Technology Group, Inc. ✓
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2 pcs
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EP20K300EFC672-3 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of Gates
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Total RAM Bits
Voltage
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EP20K300EFC672-3 Description

Short technical summary and product information.

The Intel EP20K300EFC672-3 is a field programmable gate array (FPGA) designed for embedded applications. It provides 408 input/output pins and is packaged in a 672-ball fine-pitch ball grid array (FBGA). This FPGA is suitable for complex digital logic implementations, high-speed data processing, and custom hardware acceleration. Its high I/O count makes it ideal for interfacing with multiple peripherals and external devices.

 

The device is part of Intel's FPGA product line, offering flexible programmability for various embedded system designs. Its package type allows for surface-mount assembly on printed circuit boards, supporting high-density and compact system designs. The FPGA's architecture supports a range of logic functions, making it adaptable for diverse application needs in communications, industrial automation, and data centers.

EP20K300EFC672-3 Quick Information

Product Type: Field Programmable Gate Array (FPGA)
Canonical Name: Intel FPGA EP20K300EFC672-3

EP20K300EFC672-3 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EP20K300EFC672-3 Features

  • 408 I/O pins for versatile interfacing
  • 672-ball FBGA package for compact design
  • High logic capacity for complex applications
  • Flexible programmable logic device

EP20K300EFC672-3 Applications

  • Suitable for high-gate count FPGA designs.
  • Ideal for complex digital logic implementations.
  • Used in large-scale embedded system applications.
  • Applicable in high-density logic and memory configurations.

EP20K300EFC672-3 FAQs

3 frequently asked questions generated from this part’s specifications.
What is the number of I/O pins on the EP20K300EFC672-3?

The FPGA has 408 I/O pins.

What package type does the EP20K300EFC672-3 use?

It uses a 672-ball FBGA package.

What is the logic element capacity of the FPGA?

It has a maximum of 11,520 logic elements.

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