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EP1C20F324I7 The EP1C20F324I7 is an FPGA device from Intel featuring 233 I/O pins and a 324-ball FBGA package.
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EP1C20F324I7

Available from 1 distributors
Mfr Name: Intel
Intel
The EP1C20F324I7 is an FPGA device from Intel featuring 233 I/O pins and a 324-ball FBGA package.
✓ Total Stock: 2 pcs

EP1C20F324I7 Available from 1 distributor

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✓ Non-Authorised
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Components Technology Group, Inc. ✓
Non-Authorised Inventory information
2 pcs
On Request
2 pcs On Request 1 On Request On Request On Request On Request On Request
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EP1C20F324I7 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Total RAM Bits
Voltage
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EP1C20F324I7 Description

Short technical summary and product information.

The Intel EP1C20F324I7 is a field programmable gate array (FPGA) designed for embedded applications. It features 233 input/output pins and is packaged in a 324-ball fine ball grid array (FBGA). This FPGA is suitable for complex digital logic implementations requiring high I/O count and flexible programmability. Its package design allows for surface-mount assembly on printed circuit boards, supporting high-density and high-performance designs. The device is used in various applications including communications, industrial automation, and consumer electronics where customizable digital logic is needed.

EP1C20F324I7 Quick Information

Product Type: Field Programmable Gate Array (FPGA)
Canonical Name: Intel EP1C20F324I7 FPGA

EP1C20F324I7 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EP1C20F324I7 Features

  • Supports up to 180 I/O connections for versatility.
  • Operates within a voltage range of 2.375V to 2.625V.
  • Housed in a 256-ball BGA package for surface mounting.
  • Provides 49152 RAM bits for onboard data storage.
  • Designed for complex digital logic applications.

EP1C20F324I7 Applications

  • Suitable for complex digital logic applications.
  • Ideal for high-density programmable logic designs.
  • Used in telecommunications for signal processing.
  • Applicable in industrial automation control systems.
  • Potential for military and aerospace signal processing.

EP1C20F324I7 FAQs

2 frequently asked questions generated from this part’s specifications.
What is the package type of the EP1C20F324I7?

The EP1C20F324I7 is packaged in a 324-ball FBGA.

How many I/O pins does the EP1C20F324I7 have?

The device features 233 I/O pins.

EP1C20F324I7 Alternate Parts

Same form/fit/function or matching attribute configuration across different manufacturers.
View All Alternate Parts
EP1C20F324I7N
EP1C20F324I7N
Intel
The Intel EP1C20F324I7N is a Field Programmable Gate Array (FPGA) with 20060 logic elements and 233 I/O pins. It features a surface mount package.
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