| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
5,355 pcs
|
5355 pcs | On Request | 1 | On Request | On Request | 18+ | On Request | On Request | |
|
5,355 pcs
|
5355 pcs | On Request | 1 | On Request | On Request | 18+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Clock Frequency | |
| Memory Interface | |
| Memory Organization | |
| Memory Size | |
| Memory Type | |
| Mounting Type | |
| Operating Temperature | |
| Technology | |
| Voltage |
The Micron Technology EDB8132B3PB-1D-F-R is a high-density 8 Gbit SDRAM designed for mobile and embedded applications. It utilizes LPDDR2 technology and offers a parallel interface for high-speed data exchange, supporting clock frequencies up to 533 MHz.
This component operates within a flexible voltage range of 1.14V to 1.95V, making it suitable for power-sensitive devices. It features a wide operating temperature range from -30°C to 85°C (TC), ensuring reliable performance in demanding environments. The memory is organized as 256M x 32 bits and comes in a compact 168-FBGA package.
Ideal for smartphones, tablets, wearables, and IoT edge devices, the EDB8132B3PB-1D-F-R provides the capacity and speed required for advanced features and multitasking. Its surface mount type facilitates integration into compact PCB designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.50 | $1.50 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The EDB8132B3PB-1D-F-R is a Volatile DRAM with SDRAM - Mobile LPDDR2 technology.
This component has a memory size of 8 Gbit and is organized as 256M x 32.
The clock frequency for this part is 533 MHz.
The operating voltage range is from 1.14V to 1.95V.
The operating temperature range is -30°C to 85°C (TC).
It uses a 168-FBGA (12x12) package, also referred to as 168-WFBGA.
This component is a surface mount device.