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DS34T108GN+ The Analog Devices DS34T108GN+ is a TDM Over Packet Chip designed for data transport applications. It supports various mapping methods and includes a 10/100 Ethernet MAC.
Mfr Part #:

DS34T108GN+

Available from 1 distributors
Mfr Name: Analog Devices / Maxim Integrated
Analog Devices / Maxim Integrated
The Analog Devices DS34T108GN+ is a TDM Over Packet Chip designed for data transport applications. It supports various mapping methods and includes a 10/100 Ethernet MAC.
✓ Total Stock: 2,420 pcs
$ Price Range: $0.75

DS34T108GN+ Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Optech Co.,Limited ✓
Non-Authorised Inventory information
2,420 pcs
On Request
2420 pcs On Request 1 On Request On Request 24+ On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

DS34T108GN+ Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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DS34T108GN+ Description

Short technical summary and product information.

The DS34T108GN+ from Analog Devices (formerly Maxim Integrated) is a versatile TDM-over-Packet chip designed to transport TDM streams over packet networks. It supports multiple mapping methods including SAToP, CESoPSN, TDMoIP AAL1, HDLC, and others, allowing for flexible integration into various network infrastructures like IP, MPLS, and Ethernet.

 

Key features include a full-featured E1/T1 framer and LIU, a TDMoP engine, and a 10/100 Ethernet MAC. The device supports encapsulation protocols such as IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, and Metro Ethernet, with VLAN support according to 802.1p and 802.1Q. It operates from a low-power 1.8V core voltage and 3.3V I/O voltage.

 

This chip is suitable for applications like TDM Circuit Extension Over PSN, Leased-Line Services Over PSN, and Cellular Backhaul Over PSN. It is available in a 484-BGA Exposed Pad package and is designed for surface mount.

 

The DS34T108GN+ is built with a high level of integration to minimize cost, board space, and time to market for designers.

DS34T108GN+ Quick Information

Product Type: TDM Over Packet Chip
Canonical Name: DS34T108GN+ TDM Over Packet Chip
Subcategory: Specialized ICs

DS34T108GN+ Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

DS34T108GN+ Estimated Pricing

Qty Low High
1+ $0.75 $0.75

Estimated market price range - modelled values for guidance only, not live distributor offers.

DS34T108GN+ Features

  • TDM over Packet Chip for data transport.
  • Supports SAToP, CESoPSN, TDMoIP mapping methods.
  • Includes 10/100 Ethernet MAC.
  • Operates from 1.8V core and 3.3V I/O.
  • Packaged in 484-BGA Exposed Pad.

DS34T108GN+ Applications

  • TDM Circuit Extension Over PSN.
  • Leased-Line Services Over PSN.
  • TDM Over GPON/EPON.
  • Cellular Backhaul Over PSN.

DS34T108GN+ FAQs

7 frequently asked questions generated from this part’s specifications.
What is the operating temperature range of the DS34T108GN+?

-40°C to +85°C.

What is the package type of the DS34T108GN+?

484-BGA Exposed Pad.

What are the supply voltages required for the DS34T108GN+?

Core voltage 1.8V, I/O voltage 3.3V.

What mapping methods does the DS34T108GN+ support?

SAToP, CESoPSN, TDMoIP AAL1, HDLC, Unstructured, Structured, Structured with CAS.

What encapsulation protocols are supported?

IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet.

What Ethernet MAC interface does the DS34T108GN+ include?

10/100 Ethernet MAC with MII/RMII/SSMII interface.

What processor bus interfaces are available?

Selectable 32-bit, 16-bit, or SPI.

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