DS34S108GN+ The Analog Devices DS34S108GN+ is a TDM-over-Packet chip designed for transporting TDM signals over packet networks. It supports multiple mapping methods and features a 484-BGA package.
Mfr Part #:

DS34S108GN+

Available from 1 distributors
Mfr Name: Analog Devices / Maxim Integrated
Analog Devices / Maxim Integrated
The Analog Devices DS34S108GN+ is a TDM-over-Packet chip designed for transporting TDM signals over packet networks. It supports multiple mapping methods and features a 484-BGA package.
✓ Total Stock: 2,014 pcs
$ Price Range: $0.75

DS34S108GN+ Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
2,014 pcs
2014 pcs On Request 1 On Request On Request 24+ On Request On Request

DS34S108GN+ Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Applications
Mounting Type
Supplier Device Package
Type

DS34S108GN+ Description

Short technical summary and product information.

The Analog Devices DS34S108GN+ is a highly integrated TDM-over-Packet chip that enables the transparent transport of E1, T1, E3, T3, STS-1, or other CBR signals over IP, MPLS, or Ethernet networks. It offers full support for various mapping methods including SAToP, CESoPSN, TDMoIP (AAL1), and HDLC.

 

This device features adaptive clock recovery, common clock, external clock, and loopback timing modes, with on-chip TDM clock recovery machines for each port. It can handle up to 64 independently configurable bundles or connections. The DS34S108GN+ supports multiprotocol encapsulation for IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, and Metro Ethernet, along with VLAN support according to 802.1p and 802.1Q.

 

Designed for efficiency, it operates from a low-power 1.8V core and 3.3V I/O. The chip includes a 10/100 Ethernet MAC supporting MII/RMII/SSMII interfaces and selectable 32-bit, 16-bit, or SPI processor buses. It is housed in a 484-BGA (23x23) package and is suitable for surface mounting.

 

Applications for the DS34S108GN+ include TDM circuit extension over PSN, leased-line services over PSN, TDM over GPON/EPON, TDM over cable, TDM over wireless cellular backhaul, multiservice over unified PSN, and HDLC-based traffic transport over PSN.

DS34S108GN+ Quick Information

Product Type: TDM-over-Packet Chip
Canonical Name: DS34S108GN+ TDM-over-Packet Chip
Subcategory: TDM-over-Packet

DS34S108GN+ Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected
Lead Free: Yes

DS34S108GN+ Estimated Pricing

Qty Low High
1+ $0.75 $0.75

Estimated market price range - modelled values for guidance only, not live distributor offers.

DS34S108GN+ Features

  • Transports E1, T1, E3, T3 signals over packet networks.
  • Supports SAToP, CESoPSN, TDMoIP, and HDLC mapping.
  • Features 64 independent bundles/connections.
  • Includes multiprotocol encapsulation support.
  • Surface mount 484-BGA package.

DS34S108GN+ Applications

  • TDM circuit extension over PSN.
  • Leased-line services over PSN.
  • TDM over GPON/EPON.
  • Cellular backhaul over PSN.
  • HDLC traffic transport over PSN.

DS34S108GN+ FAQs

7 frequently asked questions generated from this part’s specifications.
What types of TDM signals can the DS34S108GN+ transport over packet networks?

The DS34S108GN+ can transport E1, T1, E3, T3, STS-1, or other CBR signals over packet networks.

What mapping methods are supported by the DS34S108GN+?

Supported mapping methods include SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, and Structured with CAS.

How many independent bundles or connections can the DS34S108GN+ handle?

The device can handle up to 64 independently configurable bundles or connections.

What is the core operating voltage for the DS34S108GN+?

The core operating voltage is 1.8V.

What is the I/O voltage for the DS34S108GN+?

The I/O voltage is 3.3V.

What is the package type for the DS34S108GN+?

The DS34S108GN+ is supplied in a 484-BGA package.

What are the applications for the DS34S108GN+?

Applications include TDM circuit extension over PSN, leased-line services over PSN, TDM over GPON/EPON, TDM over cable, TDM over wireless cellular backhaul, multiservice over unified PSN, and HDLC-based traffic transport over PSN.

DS34S108GN+ Alternate Parts

Same form/fit/function or matching attribute configuration across different manufacturers.
View All Alternate Parts
DS34T102GN+
DS34T102GN+
Analog Devices / Maxim Integrated
IC TDM 484TEBGA
View Part
DS34T104GN+
DS34T104GN+
Analog Devices / Maxim Integrated
IC TDM 484TEBGA
View Part
DS34T101GN
DS34T101GN
Analog Devices / Maxim Integrated
IC TDM 484TEBGA
View Part
DS34T102GN
DS34T102GN
Analog Devices / Maxim Integrated
IC TDM 484TEBGA
View Part
Home

Categories