| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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15 pcs
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15 pcs | On Request | 1 | On Request | On Request | 1110 | On Request | On Request |
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The Samtec DPAM-23-07.0-H-8-2-A is a male differential pair array connector designed for high-density board-to-board mezzanine applications. It provides 336 signal positions configured as 168 differential pairs across 8 rows with a 2.16mm (0.085") pitch.
This connector uses surface mount technology (SMT) for reliable PCB attachment and features gold-plated contacts with a 30.0µin (0.76µm) thickness for robust signal integrity and corrosion resistance. The mated stacking height is 10mm, and the height above board is 0.262" (6.66mm).
A built-in board guide aids alignment during assembly. The connector is RoHS3 compliant and REACH unaffected, with an MSL rating of 1 (unlimited floor life). It is suitable for high-speed differential signaling in mezzanine card interconnects.
It is a male differential pair array connector.
It has 336 signal positions, configured as 168 differential pairs.
The pitch is 2.16mm (0.085").
It is a surface mount (SMT) connector.
The contacts have a gold finish with a thickness of 30.0µin (0.76µm).
The mated stacking height is 10mm.
Yes, it includes a board guide feature.