| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,087 pcs
|
1087 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Height Above Board | |
| Mated Stacking Heights | |
| Mounting Type | |
| Number of Positions | |
| Number of Rows | |
| Pitch | |
| Tape & Reel |
The Hirose DF30FC-24DS-0.4V(82) is a 24-position receptacle connector designed for board-to-board mezzanine applications. It features a dual-row configuration with a fine 0.4mm pitch, enabling high-density interconnections in compact electronic assemblies. The connector is surface mount (SMD) and offers a low profile of 0.035 inches (0.88mm) above the board.
Gold-plated contacts with a thickness of 2.00 microinches ensure reliable signal integrity and corrosion resistance. The outer shroud contact design provides robust mating alignment. The connector supports a mated stacking height of 0.9mm, making it suitable for ultra-thin device designs.
This part is compatible with tape and reel packaging for automated assembly. Compliance with RoHS3 and REACH regulations, along with an MSL of 1 (unlimited floor life), simplifies handling and manufacturing. Typical applications include smartphones, tablets, wearables, and other portable electronics where space is at a premium.
It has 24 positions arranged in 2 rows.
The pitch is 0.40mm.
It uses surface mount (SMD) mounting.
The contacts are finished with gold, 2.00 microinches thick.
The height above the board is 0.035 inches (0.88mm).
It supports a mated stacking height of 0.9mm.
Yes, it is RoHS3 compliant and also REACH unaffected.