| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
204 pcs
|
204 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Features | |
| Height Above Board | |
| Mated Stacking Heights | |
| Mounting Type | |
| Number of Positions | |
| Number of Rows | |
| Pitch |
The Hirose DF30FB-34DS-0.4V(82) is a 34-position, 2-row board-to-board receptacle designed for mezzanine stacking applications. It features a 0.4mm fine pitch and surface mount termination, making it suitable for high-density interconnections in compact electronic assemblies. The connector uses outer shroud contacts with a gold finish (2µin thickness) for reliable signal integrity. Its low profile height above board is 0.88mm, with a mated stacking height of 0.9mm, enabling slim device designs. The solder retention feature ensures secure mechanical attachment during reflow soldering. This component is RoHS3 compliant and rated MSL 1 (unlimited floor life).
34 positions.
0.40mm (0.016 inches).
Surface mount.
Gold, 2.00µin thickness.
0.88mm (0.035 inches).
0.9mm.
Solder retention.