| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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3 pcs
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3 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The DF12NB(3.0)-20DP-0.5V(51) is a board-to-board connector from Hirose's DF12N series. It offers 20 positions arranged in 2 rows with a 0.5mm pitch, making it suitable for high-density mezzanine interconnects. The connector uses surface mount technology and includes a solder retention feature for secure attachment during assembly.
With a mated stacking height of 3mm and a height above board of 2.30mm, this connector is designed for compact spaces. The contacts are finished with 8 microinches of gold, ensuring reliable and durable electrical connections. The outer shroud contacts provide additional protection and alignment.
Typical applications include board-to-board stacking in portable electronics, industrial equipment, and other devices requiring a low-profile, high-density interconnect solution. The connector is RoHS3 and REACH compliant, meeting environmental standards.
The connector has 20 positions.
The pitch is 0.50mm (0.020 inches).
The mounting type is Surface Mount.
It has 2 rows.
The contact finish is Gold with a thickness of 8.00 microinches (0.203 micrometers).
The mated stacking height is 3mm.
It includes solder retention.