| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
459 pcs
|
459 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
459 pcs
|
459 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Features | |
| Height Above Board | |
| Mated Stacking Heights | |
| Mounting Type | |
| Number of Positions | |
| Number of Rows | |
| Pitch |
The DF12NB(3.0)-14DP-0.5V(51) is a board-to-board mezzanine connector from Hirose's DF12N series. It features 14 positions in a 2-row configuration with a 0.5mm pitch, making it suitable for high-density interconnections. The connector has a header outer shroud contacts design and is surface mountable with a height above board of 0.091 inches (2.30mm). The mated stacking height is 3mm. Contacts are gold plated with a thickness of 8.00 microinches (0.203 micrometers) for reliable performance. The connector includes a solder retention feature to secure the part during soldering. This connector is RoHS3 compliant and REACH unaffected, with an MSL of 1 (unlimited).
Header, Outer Shroud Contacts.
14 positions.
0.50mm (0.020 inches).
Surface Mount.
Gold with a thickness of 8.00 microinches (0.203 micrometers).
Yes, it features solder retention.
0.091 inches (2.30mm).
3mm.