| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
784 pcs
|
784 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Features | |
| Height Above Board | |
| Mated Stacking Heights | |
| Mounting Type | |
| Number of Positions | |
| Number of Rows | |
| Pitch |
The Hirose DF12B(5.0)-40DP-0.5V(86) is a board-to-board header connector designed for mezzanine stacking applications. It features 40 positions arranged in 2 rows with a 0.5mm pitch, enabling high-density interconnections. The connector uses a surface mount mounting type and includes outer shroud contacts for alignment and protection. The contacts are finished with 8.00µin gold, ensuring reliable electrical performance and corrosion resistance. The connector has a height above board of 4.30mm and supports a mated stacking height of 5mm. It includes a solder retention feature to secure the connector during reflow soldering. This connector is RoHS3 compliant and REACH unaffected, with an MSL of 1 (unlimited). It is suitable for applications requiring compact, high-density board-to-board connections in consumer electronics, industrial equipment, and other electronic devices.
40 positions.
0.50mm (0.020").
Surface mount.
Gold with 8.00µin thickness.
4.30mm (0.169").
5mm.
Yes, it features solder retention.