| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1,000 pcs
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1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The DF12(4.0)-20DP-0.5V(86) is a board-to-board header from Hirose Electric's DF12 series. It features 20 positions arranged in 2 rows with a 0.5mm pitch, making it suitable for high-density designs. The connector uses surface mount technology and has a height above board of 3.30mm with a mated stacking height of 4mm. Contacts are gold plated with a thickness of 8.00µin (0.203µm) for reliable electrical performance.
This header includes board guide and solder retention features to aid in alignment and secure mounting during assembly. It is housed in a black resin (PA9T per PCN update) and is rated for MSL 1 (unlimited floor life). The part is RoHS and REACH compliant and is typically supplied in tape and reel packaging.
Designed for compact mezzanine or board-to-board stacking applications, this connector is ideal for use in portable electronics, industrial controls, and other devices where space is limited. The 0.5mm pitch enables high pin count in a small footprint while maintaining robust mechanical and electrical connections.
This connector has 20 positions arranged in 2 rows.
The pitch is 0.50mm (0.020").
The connector is surface mount (SMT).
The mated stacking height is 4mm.
The contact finish is gold with a thickness of 8.00µin (0.203µm).
It includes board guide and solder retention features.
The height above board is 3.30mm (0.130").