| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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18,000 pcs
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18000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Infineon CYBT-213043-02 is a versatile dual-mode Bluetooth® module supporting both Basic Rate/Enhanced Data Rate (BR/EDR) and Low Energy (LE) wireless communication. It is built around the Infineon CYW20819 silicon device and integrates an Arm® Cortex®-M4 microprocessor core with a floating-point unit (FPU).
This module complies with Bluetooth® Core Specification version 5.0 and includes support for BR, EDR 2/3 Mbps, eSCO, Bluetooth® LE, LE 2 Mbps, and Bluetooth® Mesh. It offers 256-KB of on-chip Flash memory and 176-KB of on-chip RAM, making it suitable for various embedded applications.
The CYBT-213043-02 operates within an industrial temperature range of –30°C to +85°C. It provides multiple peripheral functions including ADC, PWM, and serial communication protocols such as UART, SPI, I2C, and I2S/PCM. With up to 22 GPIOs, it offers flexibility for design integration.
The module has a compact form factor of 12.00 mm × 16.61 mm × 1.70 mm and includes an integrated PCB trace antenna. It is qualified by Bluetooth® SIG and certified for FCC, ISED, MIC, and CE standards.
| Qty | Low | High |
|---|---|---|
| 1+ | $10.96 | $10.96 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The module complies with Bluetooth Core Specification version 5.0.
The module measures 12.00 mm x 16.61 mm x 1.70 mm.
The module operates in an industrial temperature range from -30°C to +85°C.
The maximum TX output power is +4.0 dBm.
The Bluetooth LE RX receive sensitivity is -95.0 dBm.
It has 256 KB of on-chip Flash memory and 176 KB of on-chip RAM.
The module supports I2C, I2S, UART, and PCM interfaces, along with two Quad-SPI interfaces.