0402N680F500CG
Walsin Technology
The Walsin Technology 0402N680F500CG is a ceramic capacitor. It features RoHS3 compliance and MSL Level 1.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1,000 pcs
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1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Medical Grade | |
| Military Grade | |
| Storage Temperature | |
| Tape & Reel |
The CONEXANT SYSTEMS CX20582-11Z is a BGA Chipset. This component is RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 1 Unlimited, indicating it is suitable for a wide range of manufacturing environments.
This part is supplied in a BGA package. Handling precautions for BGA chips, which are moisture-sensitive devices, include baking before mounting. The recommended bake-out process involves setting the temperature and time to 125℃±5℃ for 24 hours or 80℃±5℃ for 48 hours. Specific reflow soldering temperatures depend on whether the balls are leaded (180℃-205℃ maximum) or lead-free (245℃-260℃ maximum).
This component is classified under Integrated Circuits (ICs) and specifically within the Power Management (PMIC) subcategory, as a Voltage Regulator - Linear Regulator Controller. It is designed for applications requiring reliable power management solutions.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.08 | $2.08 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The RoHS status is RoHS3 Compliant.
The MSL is Level 1 Unlimited.
BGA chips are moisture-sensitive devices and require baking before mounting. The general bake-out process is 125℃±5℃ for 24 hours or 80℃±5℃ for 48 hours.
For lead-free/No Pb BGA chips, the maximum temperature is 245℃-260℃. For leaded/Pb BGA chips, the maximum temperature is 180℃-205℃.
