CLP-106-02-G-D-BE-A-P

The Samtec CLP-106-02-G-D-BE-A-P is a low profile dual wipe socket from the CLP series, designed for board-to-board applications. It has 12 positions arranged in 2 rows with a 1.27mm pitch, providing high density interconnect in compact designs. The connector features a bottom entry receptacle with female socket contacts made of phosphor bronze plated with 0.25µm gold, rated for up to 3.4A per pin (2 pins powered). The voltage rating is 280 VAC and 395 VDC, and the operating temperature range spans -55°C to +125°C. The insulator is black liquid crystal polymer with UL94 V-0 flammability rating. Termination is surface mount solder, and the connector includes an alignment pin and pick & place pad for automated assembly. The push-pull fastening ensures secure mating with compatible headers such as Samtec FTSH, FTS, or FW series. This part is lead-free solderable and rated for 100 mating cycles with 10µ" gold finish.