| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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500 pcs
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500 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |||||||||
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30 pcs
$0.40
|
30 pcs |
$0.40
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1 | On Request | On Request | On Request | On Request | On Request |
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The TDK C2012X7S2A105M125AE is a multilayer ceramic chip capacitor (MLCC) with a capacitance of 1 µF, rated voltage of 100V, and tolerance of ±20%. It features an X7S temperature coefficient, ensuring stable capacitance over a temperature range of -55°C to 125°C. The component is surface mountable in an 0805 (2012 Metric) package with dimensions 2.00mm x 1.25mm and a maximum thickness of 1.45mm. This capacitor is part of TDK's commercial grade soft termination series, designed to absorb mechanical stress from board flexure, making it suitable for applications where the PCB may bend. It is RoHS3 compliant and REACH unaffected, with an MSL level of 1 (unlimited). Typical applications include boardflex sensitive circuits in general electronic equipment such as AV equipment, telecommunications, home appliances, and computer equipment. The soft termination feature reduces the risk of cracking due to board flexure, enhancing reliability in demanding environments. This part is not intended for use in aerospace, automotive, medical, or other high-reliability applications without prior consultation with TDK.
1 µF.
100V.
X7S.
±20%.
0805 (2012 Metric).
-55°C to 125°C.
Soft termination to absorb mechanical stress from board flexure.