| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
434 pcs
|
434 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Applications | |
| Capacitance | |
| Features | |
| Length | |
| Mounting Type | |
| Operating Temperature | |
| Package / Case | |
| Temperature Coefficient | |
| Thickness (Max) | |
| Tolerance | |
| Voltage | |
| Width |
The TDK C2012X7R1E475K125AE is a multilayer ceramic chip capacitor (MLCC) from the C series, designed for commercial-grade applications. It offers a nominal capacitance of 4.7 µF with a rated voltage of 25V and a tolerance of ±10%. The capacitor features an X7R temperature coefficient, ensuring stable capacitance over a wide operating temperature range of -55°C to 125°C.
This component is housed in an 0805 (2012 metric) package with dimensions of 2.00mm x 1.25mm and a maximum thickness of 1.50mm. It is surface-mountable and features soft termination, making it suitable for applications where board flex sensitivity is a concern. The soft termination helps reduce mechanical stress on the solder joints during thermal cycling or board bending.
Typical applications include general electronic equipment such as AV equipment, telecommunications, home appliances, and industrial robots. The capacitor is RoHS3 compliant and REACH unaffected, with an MSL rating of Level 1 (unlimited).
4.7 µF.
25V.
±10%.
X7R.
-55°C to 125°C.
0805 (2012 Metric).
Yes, it features soft termination for boardflex sensitive applications.