| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1,314 pcs
|
1314 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Laird Technologies BMI-C-004 is a fingerstock contact, categorized under RFI and EMI shielding solutions. This component is manufactured from durable Beryllium Copper and features a Gold plating for enhanced conductivity and corrosion resistance.
With a height of 5.17mm (0.204 inches) and a width of 4.32mm (0.170 inches), the BMI-C-004 offers precise dimensions for integration into electronic assemblies. Its length measures 5.97mm (0.235 inches).
The attachment method for this fingerstock is Solder, ensuring a secure and reliable connection to printed circuit boards or other components. It is designed to provide effective shielding against electromagnetic interference in various applications.
This part is compliant with RoHS3 standards and has a Moisture Sensitivity Level (MSL) of 1, indicating unlimited usability under standard conditions. REACH status is unaffected.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The fingerstock is made of Beryllium Copper.
The BMI-C-004 fingerstock has Gold plating.
The height of the BMI-C-004 fingerstock is 5.17mm (0.204 inches).
The attachment method for the BMI-C-004 fingerstock is Solder.
The BMI-C-004 fingerstock is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the BMI-C-004 fingerstock is 1 Unlimited.