| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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369 pcs
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369 pcs | On Request | 1 | On Request | On Request | 1430+ | On Request | On Request | |
| On Request | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name |
This NXP Semiconductors BLF6G10LS-200RN is an RF Power MOSFET utilizing Metal-Oxide Semiconductor technology. It is constructed with a silicon N-channel enhancement mode transistor element.
The device offers a minimum breakdown voltage of 65V and can handle a maximum drain current (ID) of 49A. It operates within the Ultra High Frequency band, making it suitable for demanding RF applications.
The MOSFET is surface-mounted and comes in a rectangular, flatpack ceramic package, sealed with metal. It has two terminals and is configured as a single element device.
Compliance information indicates RoHS3 compliance and a Moisture Sensitivity Level (MSL) of 1 Unlimited. It is also designated as Lead Free and REACH Unaffected.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The minimum breakdown voltage is 65V.
The maximum drain current (ID) is 49A.
It operates in the ULTRA HIGH FREQUENCY BAND.
It is an RF POWER MOSFET.
The FET technology is METAL-OXIDE SEMICONDUCTOR.
The transistor element material is SILICON.
The channel type is N-CHANNEL.
The operating mode is ENHANCEMENT.
It has 2 terminals.
This part is RoHS3 Compliant.
The MSL is 1 Unlimited.
Yes, this part is Lead Free.