| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
| On Request | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The BF996S,215 is an N-channel dual-gate depletion type MOS-FET designed for RF applications. It is manufactured by NXP Semiconductors and comes in a surface mount SOT-143B package. Key electrical specifications include a maximum drain-source voltage of 20V, maximum drain current of 30mA, and total power dissipation of 200mW up to 60°C ambient temperature. The device offers a typical transfer admittance of 18mS, input capacitance of 2.3pF (max 2.6pF), and feedback capacitance of 25fF. Noise figure is typically 1dB at 200MHz, making it suitable for low-noise RF stages. The dual-gate configuration allows for automatic gain control (AGC) in applications such as UHF television tuners and professional communication equipment. The junction temperature is rated up to 150°C, and storage temperature range is -65°C to +150°C. Thermal resistance from junction to ambient is 460K/W when mounted on a ceramic substrate. The device is listed as RoHS3 Compliant, REACH Unaffected, and has an MSL of 1 Unlimited.
20V.
The device is available in a TO-253-4 / TO-253AA package with a SOT-143B supplier device package.
The junction temperature is up to 150°C, and storage temperature range is -65°C to +150°C.
Yes, it is listed as RoHS3 Compliant.
1 dB typical at 200MHz.
25 dB typical.
2.3 pF typical, 2.6 pF maximum.