| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
635 pcs
|
635 pcs | On Request | 1 | On Request | On Request | N/A | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Color | |
| Failure Rate | |
| Height | |
| Length | |
| Mounting Style | |
| Thermal Resistance | |
| Width |
The CTS BDN09-3CB/A01 is an aluminum heat sink from the BDN series, designed to dissipate heat effectively in electronic applications. It has a thermal resistance of 26.4 C/W, ensuring efficient cooling. The heat sink measures 25.65 mm in length, 25.65 mm in width, and 9.02 mm in height, making it suitable for compact designs. Its vertical fin style enhances surface area for better heat dissipation. This component is designed for use with BGA, PGA, PLCC, and QFP packages. The heat sink features an adhesive mounting style for easy installation and comes in a black color. It is RoHS3 compliant and has an MSL 1 rating, indicating unlimited shelf life under recommended storage conditions. The REACH status is unaffected.
This heat sink is manufactured by CTS Corporation and is part of their thermal management solutions. It is supplied in bulk packaging. The BDN09-3CB/A01 is a reliable choice for applications requiring effective thermal management, helping to maintain optimal operating temperatures for sensitive electronic components.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.05 | $0.05 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance of the BDN09-3CB/A01 heat sink is 26.4 C/W.
The dimensions of the BDN09-3CB/A01 heat sink are 25.65 mm in length, 25.65 mm in width, and 9.02 mm in height.
The BDN09-3CB/A01 heat sink is made of aluminum.
The BDN09-3CB/A01 heat sink is mounted using an adhesive.
The BDN09-3CB/A01 heat sink is designed for BGA, PGA, PLCC, and QFP packages.