| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,805 pcs
|
2805 pcs | On Request | 1 | On Request | On Request | 17+ | On Request | On Request |
| Category | |
| Manufacturer Name |
The Broadcom Limited BCM7260ZBKFEBB3 is a specialized integrated circuit designed for various applications. This component is compliant with RoHS3 standards and has a Moisture Sensitivity Level (MSL) of 1, indicating it is unlimited in terms of handling time under standard conditions. The REACH status is unaffected, suggesting it does not contain substances of concern under REACH regulations.
This IC is supplied in a Ball Grid Array (BGA) package, which is suitable for surface mounting. The packaging utilizes industry-standard static shielding to protect the component during transit and handling. The BGA package offers good thermal performance and high pin density, making it suitable for complex electronic designs.
As a specialized IC, the BCM7260ZBKFEBB3 likely serves a specific function within a larger system, such as signal processing, control, or communication. Its exact application would depend on its internal architecture and intended use within electronic devices.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.71 | $4.71 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The BCM7260ZBKFEBB3 is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is REACH Unaffected.
The BCM7260ZBKFEBB3 is supplied in a BGA package.