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BCM63168UKFEBG BCM63168UKFEBG is a Telecom Interface IC from Broadcom Limited. It comes in a BGA package for surface mount assembly.
Mfr Part #:

BCM63168UKFEBG

Available from 3 distributors
Mfr Name: Broadcom Limited
Broadcom Limited
BCM63168UKFEBG is a Telecom Interface IC from Broadcom Limited. It comes in a BGA package for surface mount assembly.
✓ Total Stock: 67,357 pcs

BCM63168UKFEBG Available from 3 distributors

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Smaxon Electronics ✓
Non-Authorised Inventory information
59,036 pcs
On Request
59036 pcs On Request 1 On Request On Request 17+ On Request On Request
Optech Co.,Limited ✓
Non-Authorised Inventory information
7,853 pcs
On Request
7853 pcs On Request 1 On Request On Request 17+ On Request On Request
Flip Electronics ✓
Non-Authorised Inventory information
468 pcs
On Request
468 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

BCM63168UKFEBG Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Function
Mounting Type
Termination Style
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BCM63168UKFEBG Description

Short technical summary and product information.

The BCM63168UKFEBG is a Telecom Interface IC manufactured by Broadcom Limited. It is designed for high-performance telecom interface applications.

 

The device is supplied in a Ball Grid Array (BGA) package, which supports surface mount mounting with solder ball termination. This package type is well-suited for high-density PCB designs.

 

The part is marked as RoHS3 Compliant, REACH Unaffected, and has an MSL rating of 1 (unlimited floor life), though these compliance values are unverified.

BCM63168UKFEBG Quick Information

Product Type: Telecom Interface IC
Canonical Name: BCM63168UKFEBG Telecom Interface IC
Subcategory: Telecom

BCM63168UKFEBG Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

BCM63168UKFEBG Features

  • Telecom interface IC for high performance.
  • BGA package with solder ball termination.
  • Surface mount mounting supported.
  • RoHS3 compliant (unverified).
  • MSL 1 unlimited floor life (unverified).

BCM63168UKFEBG Applications

  • Used in telecom interface circuits
  • Suitable for high-performance telecom systems
  • Applied in broadband communication equipment
  • Ideal for network infrastructure modules
  • Used in surface-mount telecom designs

BCM63168UKFEBG FAQs

5 frequently asked questions generated from this part’s specifications.
What is the package type of the BCM63168UKFEBG?

The BCM63168UKFEBG is housed in a BGA (Ball Grid Array) package.

What is the mounting type for the BCM63168UKFEBG?

The mounting type is Surface Mount, inferred from the BGA package.

Is the BCM63168UKFEBG RoHS compliant?

The part is listed as RoHS3 Compliant, but this data is unverified.

What is the Moisture Sensitivity Level (MSL) of the BCM63168UKFEBG?

The MSL is listed as 1 (Unlimited), but this data is unverified.

What is the function of the BCM63168UKFEBG?

The function is Telecom Interface, as a high-performance telecom interface IC.

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