| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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223 pcs
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223 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The BCM56643B0KFSBG is a highly integrated multi-layer switch IC designed for telecom interface applications. It supports a wide range of Ethernet standards from 1GbE to 100GbE per port, making it suitable for diverse networking equipment.
This device features a multi-layer switching architecture with advanced SerDes technology for high-speed serialization and deserialization. It includes on-chip memory for packet buffering and supports multi-protocol processing from Layer 2 to Layer 4. The IC also provides robust QoS capabilities with hierarchical scheduling and congestion management.
The BCM56643B0KFSBG is packaged in a BGA (Ball Grid Array) package, which ensures reliable electrical connections and efficient thermal dissipation. It is designed for surface mount mounting, facilitating automated assembly processes. The device is intended for use in carrier-grade routers, enterprise switches, data center leaf-spine architectures, and other high-reliability networking applications.
It is an IC TELECOM INTERFACE MULTI LAYER, a high-performance telecom interface IC.
It supports data rates from 1GbE to 100GbE per port.
It is available in a BGA (Ball Grid Array) package.
It is designed for surface mount mounting.
The RoHS status is listed as RoHS3 Compliant, but this is unverified and should be treated as low confidence.
The MSL is listed as 1 Unlimited, but this is unverified and should be treated as low confidence.
The REACH status is listed as REACH Unaffected, but this is unverified and should be treated as low confidence.