| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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19 pcs
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19 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| SVHC Present |
The BCM55040BB1IFSBG is a 10G XPON Bridge Chip manufactured by Broadcom. This component is designed for high-speed fiber optic network bridging applications, supporting 10G XPON standards.
This device is RoHS3 Compliant and REACH Unaffected, meeting current environmental compliance requirements. It has a Moisture Sensitivity Level (MSL) of 1, indicating unlimited floor life before soldering, which simplifies handling and storage during manufacturing.
As a bridge IC, this part is intended for use in telecommunications infrastructure, specifically in optical network units (ONUs) and optical line terminals (OLTs) for fiber-to-the-home (FTTH) and other fiber broadband deployments.
The BCM55040BB1IFSBG is RoHS3 Compliant.
The BCM55040BB1IFSBG is REACH Unaffected.
The MSL is 1 (Unlimited), meaning it has unlimited floor life.