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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
31,020 pcs
|
31020 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Average Forward Rectified Current | |
| Capacitance @ Vr, F | |
| Continuous Reverse Voltage | |
| Current | |
| DC Forward Current | |
| Industrial Grade | |
| Junction Temperature | |
| Lead Spacing | |
| Lead Style | |
| Medical Grade | |
| Military Grade | |
| Molding Compound Flammability Rating | |
| Mounting Type | |
| Non-Repetitive Peak Forward Surge Current (Maximum @ t = 1 µs) | |
| Operating Temperature | |
| Package Weight | |
| Packaging Code | |
| Peak Soldering Temperature | |
| Power Dissipation (Maximum @ Infinite heatsink) | |
| Power Dissipation (Maximum @ On FR -4 board with recommended soldering footprint) | |
| Reel Quantity | |
| Repetitive Peak Forward Current | |
| Repetitive Peak Reverse Voltage | |
| Reverse Recovery Time (trr) | |
| Speed | |
| Storage Temperature | |
| Supplier Device Package | |
| Tape & Reel | |
| Technology | |
| Thermal Resistance Junction-to-Ambient | |
| Thermal Resistance, Junction to Lead | |
| Voltage |
The BAS21-E3-18 is a small-signal high-voltage switching diode from Vishay Semiconductors. It is designed for applications requiring fast switching with a maximum reverse recovery time of 50 ns. The diode supports a continuous reverse voltage of 200 V, repetitive peak reverse voltage of 250 V, and an average forward rectified current of 250 mA at frequencies above 50 Hz.
Electrical characteristics include a maximum forward voltage of 1.25 V at 200 mA, DC forward current of 350 mA, and non-repetitive peak forward surge current of 2.5 A for 1 µs or 0.5 A for 1 s. Power dissipation is rated at 300 mW on an FR-4 board with recommended soldering footprint and 500 mW with an infinite heatsink. Thermal resistance junction-to-ambient is 420 K/W on FR-4, and junction-to-lead is 250 K/W with infinite heatsink.
The device is housed in a TO-236-3 / SC-59 / SOT-23-3 surface-mount package with a weight of approximately 9.2 mg. The molding compound is rated UL 94 V-0, and the peak soldering temperature is 260 °C. Packaging code 18 provides 10,000 units per 13-inch reel with 8 mm tape. Operating temperature range is -55 °C to +150 °C with maximum junction temperature 150 °C.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.36 | $0.36 |
| 10+ | $0.22 | $0.22 |
| 50+ | $0.16 | $0.16 |
| 100+ | $0.14 | $0.14 |
| 500+ | $0.10 | $0.10 |
| 10,000+ | $0.06 | $0.06 |
| 30,000+ | $0.06 | $0.06 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The maximum continuous reverse voltage is 200 V; repetitive peak reverse voltage is 250 V.
Average forward rectified current is 250 mA (at f ≥ 50 Hz), with 350 mA DC forward current and 625 mA repetitive peak forward current.
Maximum forward voltage is 1.25 V at 200 mA.
Reverse recovery time is 50 ns.
Surface-mount TO-236-3 / SC-59 / SOT-23-3 package; supplier device package is SOT-23-3. Molding compound flammability rating is UL 94 V-0, peak soldering temperature 260 °C, and package weight about 9.2 mg.
Maximum power dissipation is 300 mW on FR-4 board with recommended soldering footprint, and 500 mW with infinite heatsink. Thermal resistance junction-to-ambient is 420 K/W on FR-4; junction-to-lead is 250 K/W with infinite heatsink.