| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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50 pcs
|
50 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Wire Gauge |
The TE Connectivity B-801-56 is a SolderSleeve device designed for wire-to-pin termination. It accommodates 26 AWG solid silver plated copper wire (MIL-W-81822/13) and accepts cable diameters from 2.40 to 5.00 mm. The insulation sleeve is made of heat-shrinkable, transparent blue radiation cross-linked modified polyvinylidene fluoride. The solder preform uses Sn63 solder per ANSI J-STD-006 with ROL0 flux per ANSI J-STD-004, and includes a red meltable ring for strain relief. This device operates over a temperature range of -55°C to +150°C. Installation is performed using TE Connectivity-approved convection or infrared tools following Raychem Installation Procedure RPIP-825-00. The conductor lead is white solid silver plated copper wire. This solder sleeve provides a reliable, controlled soldering connection for metallic pins, coaxial cable primaries, or tin/silver plated wires with insulation rated for at least +125°C.
| Qty | Low | High |
|---|---|---|
| 25+ | $23.22 | $23.22 |
| 50+ | $22.75 | $22.75 |
| 100+ | $22.30 | $22.30 |
| 250+ | $21.85 | $21.85 |
| 500+ | $21.41 | $21.41 |
| 1,000+ | $6.05 | $6.05 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
-55°C to +150°C.
RoHS3 Compliant (unverified).
26 AWG.
2.40 to 5.00 mm.
Sn63 solder per ANSI J-STD-006 and ROL0 flux per ANSI J-STD-004.
Using TE Connectivity-approved convection or infrared tools per Raychem Installation Procedure RPIP-825-00.
Heat-shrinkable, transparent blue radiation cross-linked modified polyvinylidene fluoride.