| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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10 pcs
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10 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Dimensions |
The ATS55450W-C1-R0 from Advanced Thermal Solutions is a high-performance heat sink designed for BGA components. It measures 45.0 x 45.0 x 24.5 mm, providing substantial surface area for heat dissipation.
This heat sink is specified as RoHS3 Compliant, indicating adherence to environmental regulations regarding hazardous substances. The Moisture Sensitivity Level (MSL) is rated at 1, meaning it has unlimited shelf life under recommended storage conditions and does not require special handling to prevent moisture absorption.
Designed for demanding thermal management applications, this heat sink is suitable for use in environments where reliable cooling of BGA packages is critical. Its construction and dimensions are optimized for efficient heat transfer away from the component.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.00 | $2.00 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The dimensions are 45.0 x 45.0 x 24.5 mm.
The RoHS status is RoHS3 Compliant.
The MSL is 1 Unlimited.
The REACH status is REACH Unaffected.