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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
91 pcs
|
91 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Hardware Kit | |
| Hole Distance (E) | |
| Hole Distance (F) | |
| Hole Pattern | |
| Length | |
| Material | |
| Material Finish | |
| Package Cooled | |
| Shape | |
| Thermal Interface Material | |
| Thermal Resistance (Typical @ Ducted, 100 LFM) | |
| Thermal Resistance (Typical @ Ducted, 200 LFM) | |
| Thermal Resistance (Typical @ Ducted, 300 LFM) | |
| Thermal Resistance (Typical @ Ducted, 400 LFM) | |
| Thermal Resistance (Typical @ Ducted, 500 LFM) | |
| Thermal Resistance (Typical @ Ducted, 600 LFM) | |
| Thermal Resistance (Typical @ Ducted, 700 LFM) | |
| Thermal Resistance (Typical @ Unducted, 200 LFM) | |
| Thermal Resistance (Typical @ Unducted, 300 LFM) | |
| Thermal Resistance (Typical @ Unducted, 400 LFM) | |
| Thermal Resistance (Typical @ Unducted, 500 LFM) | |
| Thermal Resistance (Typical @ Unducted, 600 LFM) | |
| Thermal Resistance (Typical @ Unducted, 700 LFM) | |
| Thermal Resistance @ Forced Air Flow | |
| Type | |
| Weight | |
| Width |
The ATS-P2-21-C2-R0 is a pushPIN heat sink assembly from Advanced Thermal Solutions, designed for board-level cooling of BGA, LGA, CPU, and ASIC packages. It measures 60.00mm x 60.00mm x 10.00mm (length x width x height) and is extruded from AL6063 aluminum with a blue anodized finish. The heat sink features a fine pitch XCUT fin design optimized for forced airflow conditions.
The assembly includes a push pin/spring kit (ATS-HK91-R0) for secure attachment to a PCB using a 4-corner hole pattern with 53.00mm spacing. It is pre-assembled with T766 phase-changing thermal interface material, which enhances thermal transfer by filling gaps between the heat sink and the component.
Thermal performance is documented for both unducted and ducted airflow. Under unducted flow, thermal resistance ranges from 16.28°C/W at 100 LFM to 1.51°C/W at 700 LFM. Under ducted flow, the range is 2.41°C/W at 100 LFM to 0.78°C/W at 700 LFM. The assembly weighs 40.37 grams and is RoHS3 and REACH compliant.
| Qty | Low | High |
|---|---|---|
| 1+ | $10.61 | $10.61 |
| 10+ | $9.39 | $9.39 |
| 25+ | $8.94 | $8.94 |
| 50+ | $8.62 | $8.62 |
| 100+ | $8.31 | $8.31 |
| 250+ | $7.91 | $7.91 |
| 500+ | $7.63 | $7.63 |
| 1,000+ | $7.35 | $7.35 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
60.00mm x 60.00mm x 10.00mm (length x width x height).
AL6063 aluminum with blue anodized finish.
Varies with airflow: 16.28°C/W at 100 LFM unducted, 7.67°C/W at 200 LFM, down to 1.51°C/W at 700 LFM unducted. Ducted performance ranges from 2.41°C/W at 100 LFM to 0.78°C/W at 700 LFM.
Push pin attachment via a 4-corner hole pattern with 53.00mm hole spacing. Includes the ATS-HK91-R0 push pin/spring kit.
Yes, it is RoHS3 compliant and REACH unaffected.
T766, a phase-changing material.
40.37 grams.