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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1 pcs
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1 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | 2026-04-21 06:15:22 |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Fin Pitch | |
| Hole Pattern | |
| Length | |
| Material | |
| Material Finish | |
| Package Cooled | |
| Shape | |
| Thermal Resistance (Typical @ Air Velocity: 100 LFM, Ducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 200 LFM, Ducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 200 LFM, Unducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 300 LFM, Ducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 300 LFM, Unducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 400 LFM, Ducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 400 LFM, Unducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 500 LFM, Ducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 500 LFM, Unducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 600 LFM, Ducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 600 LFM, Unducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 700 LFM, Ducted Flow) | |
| Thermal Resistance (Typical @ Air Velocity: 700 LFM, Unducted Flow) | |
| Thermal Resistance @ Forced Air Flow | |
| Type | |
| Weight | |
| Width |
The ATS-FPX025025025-76-C2-R0 is a pushPIN heat sink from Advanced Thermal Solutions, measuring 25.00mm x 25.00mm x 25.00mm (0.984" x 0.984" x 0.984"). It is constructed from extruded AL6063 aluminum with a blue anodized finish, providing a lightweight solution weighing 15.4 grams. The heat sink features a fine-pitch fin design and a right-tabbed hole pattern with 30mm hole spacing, optimized for high-velocity airflow conditions.
Thermal performance is characterized under both unducted and ducted flow conditions. Under unducted flow, thermal resistance ranges from 11.60°C/W at 100 LFM down to 1.80°C/W at 700 LFM. Under ducted flow, performance improves significantly, with thermal resistance ranging from 3.00°C/W at 100 LFM to 1.30°C/W at 700 LFM. These values are typical and measured with the heat sink oriented for top-mount attachment.
The heat sink is designed for top-mount attachment using push pins, which are sold separately. The push pin system features flexible barbs that engage with pre-drilled holes in a PCB, with compression springs providing the necessary holding force. The heat sink is pre-assembled with phase-changing material (T766) for enhanced thermal performance, though double-sided thermal tape and no-TIM options are available for specific application requirements.
This heat sink is suitable for cooling a variety of packages including BGA, LGA, CPU, and ASIC devices. All components are RoHS and REACH compliant. The heat sink is supplied as the heat sink only; the complete pushPIN assembly must be ordered separately.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.34 | $4.34 |
| 10+ | $3.84 | $3.84 |
| 25+ | $3.66 | $3.66 |
| 50+ | $3.53 | $3.53 |
| 100+ | $3.40 | $3.40 |
| 250+ | $3.24 | $3.24 |
| 500+ | $3.12 | $3.12 |
| 1,000+ | $3.01 | $3.01 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
Under unducted flow, thermal resistance ranges from 11.60°C/W at 100 LFM to 1.80°C/W at 700 LFM. Under ducted flow, it ranges from 3.00°C/W at 100 LFM to 1.30°C/W at 700 LFM.
The heat sink measures 25.00mm x 25.00mm x 25.00mm (0.984" x 0.984" x 0.984").
The heat sink is made of extruded AL6063 aluminum with a blue anodized finish.
It is a top-mount heat sink attached using push pins, which are sold separately. The push pins feature flexible barbs that engage with pre-drilled holes in a PCB.
Yes, the heat sink is RoHS3 compliant and REACH unaffected as confirmed in the datasheet.
The heat sink weighs 15.4 grams.
It is suitable for cooling assorted packages including BGA, LGA, CPU, and ASIC devices.