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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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10 pcs
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10 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Thermal Resistance (Typical @ Ducted Flow @ 200 LFM) | |
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The ATS-54310K-C1-R0 is a high performance straight fin BGA heat sink designed for compact PCB environments. It comes preassembled with a high performance thermal interface material (thermal tape) for easy attachment to BGA and other surface mount packages.
The heat sink measures 31.00 mm x 31.00 mm with a fin height of 14.50 mm. It is constructed from aluminum with a black anodized finish, which enhances thermal emissivity and corrosion resistance. Attachment is via the included thermal tape/adhesive.
Thermal performance data (typical) under forced air flow: unducted flow yields 6.2°C/W at 200 LFM, 4.6°C/W at 300 LFM, 3.9°C/W at 400 LFM, 3.4°C/W at 500 LFM, 3.1°C/W at 600 LFM, 2.9°C/W at 700 LFM, and 2.7°C/W at 800 LFM. Under ducted flow at 200 LFM, thermal resistance is 3.3°C/W.
The heat sink is RoHS-6 and REACH compliant. An equivalent part, ATS-54310K-C2-R0, uses a different thermal interface material (Saint-Gobain C675).
| Qty | Low | High |
|---|---|---|
| 1+ | $11.64 | $11.64 |
| 10+ | $10.30 | $10.30 |
| 25+ | $9.81 | $9.81 |
| 50+ | $9.46 | $9.46 |
| 100+ | $9.12 | $9.12 |
| 300+ | $8.60 | $8.60 |
| 500+ | $8.37 | $8.37 |
| 1,000+ | $8.06 | $8.06 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
Typical thermal resistance under unducted flow: 6.2°C/W at 200 LFM, 4.6°C/W at 300 LFM, 3.9°C/W at 400 LFM, 3.4°C/W at 500 LFM, 3.1°C/W at 600 LFM, 2.9°C/W at 700 LFM, and 2.7°C/W at 800 LFM. Under ducted flow at 200 LFM: 3.3°C/W.
Overall length: 31.00 mm, overall width: 31.00 mm, fin height: 14.50 mm.
Aluminum with a black anodized finish.
Yes, it is RoHS-6 compliant as certified by the manufacturer.
Using thermal tape/adhesive, which is included with the heat sink.
It is designed specifically for BGA packages and other surface mount packages.
Yes, ATS-54310K-C2-R0 is an equivalent heat sink assembly with a different thermal interface material (Saint-Gobain C675).