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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
24 pcs
|
24 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Attachment Method | |
| Automotive Grade | |
| Fin Height | |
| Industrial Grade | |
| Lead Style | |
| Length | |
| Material | |
| Material Finish | |
| Medical Grade | |
| Military Grade | |
| Package Cooled | |
| SVHC Present | |
| Shape | |
| Thermal Resistance @ Forced Air Flow | |
| Type | |
| Width |
The ATS-50290G-C1-R0 is a top-mount heat sink from Advanced Thermal Solutions, designed to cool BGA packages. It measures 29.00mm x 29.00mm at the base and has a fin height of 12.50mm, giving it a low profile for board-level applications.
The heat sink is constructed from aluminum with a blue anodized finish, which provides good corrosion resistance and a durable surface. Its square shape with angled fins enhances heat dissipation under forced airflow, offering a thermal resistance of 4.50°C/W at 200 LFM. This makes it suitable for moderate power densities in a variety of electronic systems.
Attachment is accomplished using a clip and thermal interface material, simplifying assembly. The top-mount configuration allows direct placement on BGA devices, and the compact footprint fits standard 29mm packages. It is a practical thermal management solution for embedded, networking, and industrial applications.
BGA (Ball Grid Array) packages.
Yes, RoHS3 compliant (unverified, low confidence).
29.00mm x 29.00mm x 12.50mm (length x width x fin height).
4.50°C/W typical at 200 LFM forced air flow.
Aluminum with a blue anodized finish.
Clip and thermal material.
Square with angled fins.