| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
6,224 pcs
|
6224 pcs | On Request | 1 | On Request | On Request | 21+ | On Request | On Request | |
|
2,774 pcs
|
2774 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Microchip Technology ATA663231-GBQW is a specialized integrated circuit functioning as a LIN System Basis Chip. It is designed for surface mount applications with wettable flank termination, ensuring reliable soldering. The component is housed in an 8-VDFN Exposed Pad package, specifically an 8-VDFN (3x3) configuration.
This device is classified under Specialized ICs within the Power Management (PMIC) category. It is identified as RoHS3 Compliant, with a Moisture Sensitivity Level (MSL) of 1 (Unlimited), and REACH Unaffected status. These compliance details are based on available database information and should be reviewed for critical applications.
Ideal for systems requiring LIN communication, this chip integrates essential functions for a LIN node. Its surface-mount design facilitates automated assembly processes, making it suitable for high-volume production environments. The specific package type and mounting method are crucial considerations for board layout and thermal management.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.44 | $0.44 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The ATA663231-GBQW is a LIN System Basis Chip.
The mounting type is Surface Mount, Wettable Flank.
The ATA663231-GBQW is supplied in an 8-VDFN Exposed Pad package, specifically an 8-VDFN (3x3) configuration.
The ATA663231-GBQW is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is REACH Unaffected.