| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
169 pcs
|
169 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Density | |
| Operating Temperature | |
| Operating Voltage | |
| SVHC Present |
The ASFC10G31P3-51BIN is an embedded MultiMediaCard (eMMC) NAND flash memory device manufactured by Alliance. It provides 4 gigabytes of storage using MLC (Multi-Level Cell) NAND technology. The device supports the MMC 5.1 interface standard and communicates over an x8-bit bus width.
Operating from a supply voltage of 2.7V to 3.6V, this memory is rated for industrial temperature environments with a range of -40°C to 85°C. The part is housed in a compact 153-ball Fine-pitch Ball Grid Array (FBGA) package measuring 11.5 x 13 mm.
This eMMC solution is suited for embedded applications requiring reliable non-volatile storage in space-constrained designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
MLC (Multi-Level Cell)
5.1
x8
4GB
2.7V to 3.6V
-40°C to 85°C
153-ball FBGA (11.5 x 13mm)