AS4C64M8D3-12BIN The Alliance AS4C64M8D3-12BIN is a Memory IC. It features RoHS3 Compliance and MSL 1 Unlimited.
Mfr Part #:

AS4C64M8D3-12BIN

Available from 1 distributors
Mfr Name: Alliance
Alliance
The Alliance AS4C64M8D3-12BIN is a Memory IC. It features RoHS3 Compliance and MSL 1 Unlimited.
Total Stock: 278 pcs
$ Price Range: $1.28

AS4C64M8D3-12BIN Available from 1 distributor

Authorised
Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
278 pcs
278 pcs On Request 1 On Request On Request On Request On Request On Request

AS4C64M8D3-12BIN Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Style

AS4C64M8D3-12BIN Description

Short technical summary and product information.

The Alliance AS4C64M8D3-12BIN is a memory integrated circuit from Alliance Memory. This component is designed for various memory applications.

 

Key specifications include RoHS3 Compliance, indicating adherence to environmental standards. It also has a Moisture Sensitivity Level (MSL) of 1 Unlimited, meaning it requires no special handling regarding moisture.

 

While specific operating voltage and temperature details are not provided, its classification as a memory IC suggests suitability for data storage and retrieval systems. The part number AS4C64M8D3-12BIN identifies this specific configuration within Alliance Memory's product line.

AS4C64M8D3-12BIN Quick Information

Product Type: Memory IC
Canonical Name: Alliance AS4C64M8D3-12BIN Memory
Subcategory: Memory

AS4C64M8D3-12BIN Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

AS4C64M8D3-12BIN Estimated Pricing

Qty Low High
1+ $1.28 $1.28

Estimated market price range - modelled values for guidance only, not live distributor offers.

AS4C64M8D3-12BIN Features

  • RoHS3 Compliant for environmental standards.
  • MSL 1 Unlimited moisture sensitivity.
  • Alliance Memory part number AS4C64M8D3-12BIN.

AS4C64M8D3-12BIN Applications

  • DDR3 SDRAM for industrial embedded applications.
  • Memory for networking and telecommunications equipment.
  • Used in data acquisition and computing systems.
  • Suitable for high-density server memory modules.

AS4C64M8D3-12BIN FAQs

3 frequently asked questions generated from this part’s specifications.
What is the RoHS status of the AS4C64M8D3-12BIN?

The AS4C64M8D3-12BIN is RoHS3 Compliant.

What is the Moisture Sensitivity Level (MSL) for the AS4C64M8D3-12BIN?

The MSL for the AS4C64M8D3-12BIN is 1 Unlimited.

What is the REACH status of the AS4C64M8D3-12BIN?

The AS4C64M8D3-12BIN is REACH Unaffected.

AS4C64M8D3-12BIN Alternate Parts

Same form/fit/function or matching attribute configuration across different manufacturers.
View All Alternate Parts
TPA2011D1YFF
TPA2011D1YFF
Texas Instruments
The TPA2011D1YFF is an evaluation module for a low-power, Class-D, mono audio power amplifier from Texas Instruments. It delivers up to 2.57W into 4 ohms.
View Part
LCMXO2280C-3FTN256I
LCMXO2280C-3FTN256I
lat
The Lattice LCMXO2280C-3FTN256I is an FPGA designed for embedded applications. It offers RoHS3 compliance and a Moisture Sensitivity Level of 1.
View Part
XC7K325T-2FFG676I4304
XC7K325T-2FFG676I4304
Xilinx
The Xilinx XC7K325T-2FFG676I4304 is a Field Programmable Gate Array (FPGA). It features RoHS3 compliance and an MSL of 1 Unlimited.
View Part
TC74LCX245FK ELK,M
TC74LCX245FK ELK,M
Toshiba
The Toshiba TC74LCX245FK ELK,M is a buffer, driver, receiver, and transceiver. It is RoHS3 Compliant and has an MSL of 1 Unlimited.
View Part
Home
Account

Categories