| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,620 pcs
|
3620 pcs | On Request | 1 | On Request | On Request | 22+ | On Request | On Request | |
|
1,514 pcs
|
1514 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Alliance AS4C64M16D2A-25BIN is a high-speed CMOS Double-Data-Rate-Two (DDR2) synchronous dynamic random-access memory (SDRAM) with a density of 1024 Mbits and 16-bit wide data I/Os. It operates with a VDD and VDDQ supply of 1.8V ± 0.1V and supports a fast clock rate of 400 MHz.
This device features 8 internal banks for concurrent operation and a 4-bit prefetch architecture. It complies with JEDEC standards and offers features such as programmable Mode & Extended Mode registers, posted CAS# additive latency (AL) from 0 to 6, and write latency equal to read latency minus 1 tCK. The memory supports burst lengths of 4 or 8.
Packaged in an 84-ball FBGA measuring 8 x 12.5 x 1.2mm (max), the AS4C64M16D2A-25BIN is designed for surface mounting. It also includes features like Off-Chip Driver (OCD) impedance adjustment and On-die termination (ODT). The component is RoHS compliant and Pb and Halogen Free.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The memory density is 1024Mbit (1Gbit).
The data width is 16 bits.
VDD and VDDQ are 1.8V ±0.1V.
The fast clock rate is 400MHz.
Burst lengths of 4 and 8 are supported.
The device is available in an 84-ball FBGA package measuring 8 x 12.5 x 1.2mm.
The operating temperature range is -40°C to +95°C. The average refresh period is 7.8µs for TC from -40°C to +85°C, and 3.9µs for TC above +85°C to +95°C.