BC847BS.115
NXP Semiconductors
The BC847BS.115 is a bipolar transistor array from NXP Semiconductors. It features RoHS3 compliance and an MSL of 1 Unlimited.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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138,287 pcs
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138287 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Industrial Grade | |
| SVHC Present | |
| Tape & Reel |
The AS4C32M16D2C-25BIN from Alliance Memory is a high-performance DDR2 Synchronous Dynamic Random-Access Memory (SDRAM) module. This component offers a memory density of 512 Megabits (Mb), organized as 32M locations by 16 bits (32M x 16).
Designed for demanding applications, it operates at a voltage of 1.8V and achieves a clock frequency of 400 MHz. The memory operates within an industrial temperature range of -40°C to 95°C, making it suitable for various environmental conditions. The package type is an 84-ball Fine-Pitch Ball Grid Array (FBGA).
This DDR2 SDRAM is supplied in standard packs of 209 units per tray, with a full box quantity of 2090 units. Its specifications make it a suitable choice for embedded systems, networking equipment, and other applications requiring reliable and fast memory solutions.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The AS4C32M16D2C-25BIN is a DDR2 SDRAM.
This component has a memory size of 512Mb and an organization of 32M x 16.
The operating voltage is 1.8V.
The operating temperature range is -40°C to 95°C.
It uses an 84-ball FBGA package.
The frequency is 400 MHz.