| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
9,943 pcs
|
9943 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Density | |
| Memory Type | |
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| SVHC Present |
The Alliance AS4C1G16D4-062BIN is an End-of-Life (EOL) DDR4 Synchronous DRAM (SDRAM) integrated circuit from Alliance Memory. This component offers a density of 4Gb and an organization of 256Mx16.
It is designed for surface mount applications and comes in a 96-ball FBGA package. The device is specified for industrial temperature ranges, operating from -40°C to 95°C, as well as commercial extended ranges from 0°C to 95°C.
Compliance information indicates RoHS3 compliance and a Moisture Sensitivity Level (MSL) of 1 (Unlimited). The REACH status is noted as unaffected.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The density of the AS4C1G16D4-062BIN is 4Gb.
The organization of the AS4C1G16D4-062BIN is 256Mx16.
The AS4C1G16D4-062BIN is a DDR4 SDRAM.
The AS4C1G16D4-062BIN is supplied in a 96-ball FBGA package.
The RoHS status of the AS4C1G16D4-062BIN is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for this part is 1 Unlimited.