| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
18,634 pcs
|
18634 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Industrial Grade | |
| Lead Spacing | |
| Lead Style | |
| Memory Organization | |
| Memory Size | |
| Mounting Type | |
| Operating Temperature | |
| Operating Voltage | |
| SVHC Present | |
| Storage Temperature | |
| Write Cycle Time |
The Alliance AS4C128M32MD2A-25BIN is a high-speed CMOS dynamic random-access memory (DRAM) with a capacity of 4Gbit. Internally configured as an eight-bank DRAM, it features a x32 data width and operates at a clock frequency of up to 533 MHz, with a nominal frequency of 400 MHz for this specific part number.
Key electrical characteristics include an operating voltage range of 1.14V to 1.95V and a write cycle time of 15 ns. The memory organization is 128M x 32, supporting concurrent operations across eight internal banks. This DDR2 SDRAM is designed for industrial applications, with an operating temperature range of -40°C to +85°C.
The component is housed in a 134-ball FBGA package, measuring 10.0mm x 11.5mm x 1.0mm, and is designed for surface mounting. It supports various low-power features such as Auto TCSR, PASR, DPD mode, and DS control, making it suitable for power-sensitive applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
1.14V to 1.95V.
134-FBGA (Fine-Pitch Ball Grid Array).
-40°C to +85°C (industrial).
533 MHz.
4 Gbit.
32 bits (x32).
15 ns (word/page).