| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,096 pcs
|
1096 pcs | On Request | 1 | On Request | On Request | 23+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Clock Frequency | |
| Industrial Grade | |
| Medical Grade | |
| Memory Format | |
| Memory Interface | |
| Memory Organization | |
| Memory Size | |
| Memory Type | |
| Military Grade | |
| Mounting Type | |
| Operating Temperature | |
| Operating Voltage | |
| Supplier Device Package | |
| Technology | |
| Voltage | |
| Write Cycle Time |
The Alliance Memory AS4C128M32MD2A-25BIN is a high-speed CMOS dynamic random-access memory (DRAM) with a capacity of 4Gbit. It is internally configured as an eight-bank DRAM, organized as 128M x 32. This device utilizes DDR2 SDRAM technology, specifically designed for mobile low-power applications (LPDDR2).
Key electrical specifications include a clock frequency of 400 MHz and an operating voltage range of 1.14V to 1.95V. The write cycle time is 15ns. The operating temperature range for this industrial-grade component is -40°C to +85°C.
The memory interface is parallel, and the technology is SDRAM - Mobile LPDDR2. The package type is a 134-Ball FBGA with dimensions of 10.0mm x 11.5mm x 1.0mm, and it is designed for surface mounting.
This component supports features such as auto refresh and self-refresh, programmable read and write latencies, and programmable burst lengths. Low power features include a low voltage power supply, Temperature Compensated Self Refresh (TCSR), Partial Array Self Refresh (PASR), Deep Power Down (DPD) Mode, and Driver Strength (DS) Control.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.24 | $1.24 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The memory size is 4Gbit.
The clock frequency is 400 MHz.
The operating voltage range is 1.14V to 1.95V.
The operating temperature range is -40°C to +85°C.
It is supplied in a 134-FBGA package.
The memory organization is 128M x 32.
The write cycle time is 15ns.