| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,700 pcs
|
2700 pcs | On Request | 1 | On Request | On Request | 1209+ | On Request | On Request |
| Category | |
| Manufacturer Name |
The ATHEROS TECHNOLOGY LTD. AR8152-B is a specialized integrated circuit designed for various applications. This component adheres to RoHS3 compliance standards and has a Moisture Sensitivity Level (MSL) of 1, indicating it is suitable for a wide range of manufacturing environments.
As a BGA chipset, the AR8152-B requires specific handling precautions. Devices classified as BGA are moisture-sensitive and typically require baking before mounting to prevent damage during soldering processes. The manufacturer provides guidelines for baking, suggesting temperatures and durations such as 125℃±5℃ for 24 hours or 80℃±5℃ for 48 hours. Proper handling ensures the integrity and performance of the component.
This IC is categorized under specialized interface components, suggesting its use in specific communication or data processing roles within electronic systems. Its design and specifications are tailored for particular functionalities where standard ICs may not suffice. The component is available new, with quality assurance markings from the manufacturer.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.71 | $4.71 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The AR8152-B is RoHS3 Compliant.
The MSL for the AR8152-B is 1 Unlimited.
BGA chips are moisture-sensitive devices and require baking before mounting. A general bake-out process involves placing the bag on a tray in a baking dry cabinet at 125℃±5℃ for 24 hours or 80℃±5℃ for 48 hours.
For lead-free/No Pb BGA chips, the maximum temperature is 260℃.
For leaded/Pb BGA chips, the maximum temperature is 205℃.