| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,292 pcs
|
2292 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Operating Temperature |
The AMPAK Technology AP6275S is a compact Wi-Fi and Bluetooth module designed for seamless wireless connectivity. It supports IEEE802.11 a/b/g/n/ac/ax standards, including Wi-Fi 6, with dual-stream spatial multiplexing capabilities achieving data rates up to 1200 Mbps.
Integrated Bluetooth 5.3 functionality is provided alongside Wi-Fi. The module utilizes an SDIO interface for Wi-Fi communication and UART/PCM interfaces for Bluetooth. It operates within a temperature range of -30°C to 85°C and is built around the Synaptics SYN43752 IC.
This module is suitable for applications requiring robust wireless communication, such as tablets, OTT boxes, and portable devices. It is offered in a stamp type form factor with dimensions of 15x13mm and supports both 2.4GHz and 5GHz bands.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It supports 802.11a/b/g/n/ac/ax (Wi-Fi 6).
Up to 1200 Mbps.
SDIO for Wi-Fi and UART/PCM for Bluetooth.
Bluetooth 5.3.
-30°C to 85°C.
Stamp type package measuring 15x13mm.
Linux, Android, and RTOS.