SL3S1206FUD2/HAA-VB2
NXP Semiconductors
The NXP Semiconductors SL3S1206FUD2/HAA-VB2 is a Chassis Mount Resistor. It is RoHS3 Compliant and REACH Unaffected.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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3,300 pcs
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3300 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
20 pcs
|
20 pcs | On Request | 1 | On Request | On Request | 16+ | On Request | On Request |
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| Manufacturer Name | |
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| Tape & Reel |
The AP6210 from AMPAK is a System-in-Package (SIP) module designed for wireless communication. It integrates WiFi 802.11b/g/n and Bluetooth 4.0 capabilities into a single module, simplifying design and reducing board space.
This module supports standard WiFi protocols including 802.11b, 802.11g, and 802.11n, providing reliable wireless networking. The integrated Bluetooth 4.0 functionality allows for low-power wireless connectivity for various applications.
The AP6210 is specified as RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 1, indicating it is suitable for a wide range of manufacturing environments. Its REACH status is unaffected.
This SIP module is ideal for embedded systems requiring integrated wireless communication, such as IoT devices, consumer electronics, and industrial control systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.93 | $1.93 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The AP6210 supports WiFi 802.11b/g/n.
The AP6210 integrates Bluetooth 4.0.
The AP6210 is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the AP6210 is 1 Unlimited.
The REACH status of the AP6210 is Unaffected.
