SL3S1206FUD2/HAA-VB2
NXP Semiconductors
The NXP Semiconductors SL3S1206FUD2/HAA-VB2 is a Chassis Mount Resistor. It is RoHS3 Compliant and REACH Unaffected.
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30 pcs
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30 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The AM27C256-200JC is a memory integrated circuit manufactured by Advanced Micro Devices (AMD). This component is housed in a DIP28 package, indicating a through-hole mounting style.
Key specifications include RoHS3 compliance and a Moisture Sensitivity Level (MSL) of 1, signifying unlimited usability under standard conditions. The REACH status is unaffected.
This memory IC is suitable for various electronic applications requiring reliable data storage. Its DIP package facilitates easy integration into circuit boards using traditional through-hole soldering methods. The component's compliance with environmental standards like RoHS3 makes it suitable for a wide range of manufacturing processes.
| Qty | Low | High |
|---|---|---|
| 1+ | $10.03 | $10.03 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The AM27C256-200JC comes in a DIP28 package.
Yes, the AM27C256-200JC is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the AM27C256-200JC is 1 Unlimited.
The REACH status for the AM27C256-200JC is REACH Unaffected.
