| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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3,439 pcs
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3439 pcs | On Request | 1 | On Request | On Request | 09+ | On Request | On Request |
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The ADM8668FXA12G is a Wireless Network Bridging System on Chip (SoC) manufactured by Infineon Technologies. It is designed for wireless network bridging applications, enabling connectivity between different network segments. The device is packaged in bulk, suitable for prototyping and production. It is compliant with RoHS requirements and REACH unaffected, with a Moisture Sensitivity Level (MSL) of Level 1 Unlimited. The part is available in new original condition. It is typically used in embedded systems requiring wireless bridging capabilities.
The packaging method is Bulk.
The RoHS status is compliant (RoHS3), but unverified.
The MSL is Level 1 Unlimited.
The REACH status is unaffected.
It is a Wireless Network Bridging System on Chip (SoC).
Infineon Technologies.