| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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230 pcs
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230 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Actel A2F500M3G-1FGG256I is a highly integrated Field Programmable Gate Array (FPGA) from the SmartFusion family. It uniquely combines a programmable logic matrix, a hard 100 MHz 32-bit ARM Cortex-M3 microcontroller subsystem (MSS), and a programmable analog block within a single chip. This cSoC (Customizable System-on-Chip) architecture provides significant design flexibility.
Key electrical specifications include up to 500,000 gates, 11520 logic elements (CLBs), and 16 Gbps of on-chip memory bandwidth. The integrated ARM Cortex-M3 offers 1.25 DMIPS/MHz performance and features like a Memory Protection Unit (MPU), single-cycle multiplication, and hardware divide. On-chip memory includes embedded nonvolatile flash (128-512 KB) and high-speed SRAM (16-64 KB).
Connectivity options include a 10/100 Ethernet MAC, two I2C peripherals, two UARTs, and two SPI peripherals. The device also incorporates up to three 12-bit SAR ADCs with sample rates up to 500 kSPS and one sigma-delta DAC per ADC. The FPGA fabric is based on a 130nm, 7-layer metal, flash-based CMOS process, offering nonvolatile, instant-on operation.
The A2F500M3G-1FGG256I is supplied in a 256-pin PBGA package measuring 17 x 17 mm with a 1.6 mm height and 1 mm pitch. It is designed for surface mounting and operates across a wide temperature range of -55°C to 150°C.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.50 | $2.50 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The device has 11,520 logic elements.
It comes in a 256-pin BGA package (FGG256) measuring 17x17 mm with 1 mm pitch.
It uses the ProASIC3 FPGA fabric.
It integrates an ARM Cortex-M3 microcontroller subsystem running at 100 MHz.
The operating temperature range is -55°C to 150°C.
The FPGA fabric supports up to 350 MHz system performance.
It includes 128 KB to 512 KB embedded nonvolatile flash (eNVM) and 16 KB to 64 KB high-speed SRAM (eSRAM).