| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
700 pcs
|
700 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Architecture | |
| Connectivity | |
| Core Processor | |
| Flash Size | |
| Lead Spacing | |
| Operating Temperature | |
| Peripherals | |
| Primary Attributes | |
| RAM Size | |
| SVHC Present | |
| Speed | |
| Supplier Device Package |
The Microsemi A2F060M3E-TQG144I is a SmartFusion customizable System-on-Chip (cSoC) that integrates a 32-bit ARM Cortex-M3 processor with a ProASIC3 FPGA fabric in a single device. The Cortex-M3 core is rated for 80MHz operation and delivers 1.25 DMIPS/MHz throughput. The device includes 128KB of embedded nonvolatile flash memory (eNVM) and 16KB of embedded high-speed SRAM (eSRAM).
The ProASIC3 FPGA fabric provides 60K system gates and 1536 D-type flip-flops, enabling custom hardware acceleration and flexible I/O expansion. Connectivity options include EBI/EMI, I²C, SPI, and UART/USART interfaces. On-chip peripherals include DMA, POR, and WDT. The device is housed in a 144-pin LQFP package (supplier device package 144-TQFP 20x20mm) and operates over a junction temperature range of -40°C to 100°C.
The core processor is an ARM Cortex-M3.
The nominal operating frequency is 80MHz.
It has 128KB of flash memory and 16KB of RAM.
It is available in a 144-LQFP package (supplier device package 144-TQFP 20x20mm).
The operating temperature range is -40°C to 100°C (junction temperature).
It is listed as RoHS3 compliant, but this data is unverified and has low confidence.
It supports EBI/EMI, I²C, SPI, and UART/USART interfaces.