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5 pcs
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5 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Capital Advanced Technologies 9163 is a proto board designed for prototyping and fabrication applications. It facilitates the conversion of Surface Mount Device (SMD) components to Single In-line Package (SIP) configurations.
This board features 16 positions and is designed to accept SOIC packages. The pitch is 1.27mm (0.050"), and the board thickness is 0.031" (0.79mm). It is constructed from FR4 Epoxy Glass material, ensuring durability and reliability for various projects.
The dimensions of the board are 16.51mm (0.650") in length and 40.64mm (1.600") in width. This compact size makes it suitable for integration into a wide range of electronic designs. The proto board type is specifically SMD to SIP, making it a versatile tool for engineers and hobbyists.
Compliance information indicates RoHS3 compliance and MSL 1 Unlimited status. REACH status is unaffected. This proto board is ideal for projects requiring the integration of SMD components into a breadboard or other SIP-based systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The Capital Advanced Technologies 9163 is an SMD to SIP proto board.
The 9163 proto board accepts SOIC packages.
The 9163 proto board has 16 positions.
The pitch of the 9163 proto board is 1.27mm (0.050").
The 9163 proto board is made of FR4 Epoxy Glass.
The 9163 proto board measures 16.51mm (0.650") in length and 40.64mm (1.600") in width.
The 9163 proto board is RoHS3 Compliant.